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Telecon 20180131
Attending: Brian, Julian, Hannes, Amy, Tom, Kris, Shaul, Karl, Qi, Roger, Graca
Notes by : Karl/Qi
Agenda
- Preparing the next Teamx-I (.pdf)
- Report about systematics work (delayed to next week)
- Cleaned up focal plane version 4 (.pdf)
- GRASP status (.pdf)
Notes
Preparing the next Teamx-I – By learning from previous one.
- response from TeamX, 90 slides on sub-systems.
- Section summaries in presentation. No cost discussion today. 15 pages in each sub-system.
- Need to do homework on some items before next TeamX
- Systems:
- I&T will be analyzed in next teamX, was not analyzed here. Still marked as weakness due to complexity.
- telescope systems at various temperatures (40 K, 4 K, 100 mK) make testing the end to end alignment challenging.
- Will continue discussion with Bill J. and Tomo next week.
- Definition: OGSE, optical ground support equipment. Testing equipment that doesn't fly.
- Future threats: add “cost of cooler” Comments: this is a cost threat more than a technology threat
- FP and detectors
- Str: TES have ground based heritage. detector 1/f shown to be acceptable. future options for MKIDS.
- Roger will lead 1/f story for final report. Tomasso is running gain variation and per rotation calibration options (assuming 10 mHz 1/f knee)
- General comment: detector 1/f isn't the only important 1/f term. Other issues (temperature stability) may dominate.
- Only modulation is sky rotation and scan speed.
- Weak + future threat: Impact of cosmic rays.
- Jeff Fillipini has looked into this. As has Roger. Roger will lead report summary.
- Work to reduce impact is also being done at Berkeley.
- Hannes: What about optical coupling?
- This hasn't been finalized. Roger: coupling via lenslets hasn't been shown at high frequencies.
- Electronics
- Weak: Temperature limits.
- TeamX assumed what is currently used. but would used space qualified electronics, so this won't be an issue
- Amy: TeamX usually gives reports to science teams, not reviewers. Amy is talking with TeamX/NASA to point out that reports need to be crafted so a general review audience understands the issues. Easily address comments like this risk getting blown out of porportion.
- Optics:
- Weakness: maturity of mechanical and thermal design of focal plane.
- this work is in progress for next TeamX
- Thermal:
- 3HE, testing for MIRI was expensive. even if those tests done for PICO, < $1M so ignore it.
- Cost is large. $900M for cooling, 50% of instrument cost. This is largest thermal risk point.
- Mechanical:
- Strength: scalable, simple, nothing radical
- Weakness: optics alignment complex.
- Address by pointing out WMAP and Planck have done this successfully, should not be weakness, will address in next TeamX
- Configuration
- Threat: No volume margin for primary mirror inside the shade
- Shaul: this is being worked on, should have some margin by next TeamX
Focal Plane V4 (Karl)
- simpler focal plane, 2 wafer sizes.
- roughly 1000 more detectors at high frequency. Sensitivity same. (0.61 uK vs 0.62)
- FP could go further out in X,
- Current reflectors need to be larger if we increase focal plane; but we can increase focal plane with current strehl limits.
- Central wafer issues:
- multi- and mono band pixels coexist
- insufficient bond pads for number of bolos on this wafer.
- 4000 bolos on 4“ wafer. Hannes: fit ~2000 bolos on 6” wafer in past.
- We are assuming 100 um per bond pad. 4 inch wafer.
- 2 mm between tiles, may be too small. For EBEX, ~5 mm. Karl to check
- Roger to get spacing number from recent BICEP arrays
- Kris: We need to think about how pixels are aligned to scan direction and how this impacts map making.
- are we making single detector maps? multi detector maps? do pixels need to follow the same path on the sky as a neighbor?
- This may require slight rotations of the focal plain.
Last modified: 2018/02/01 13:40 by kyoung
