Telecon Notes July 11, 2018

Attendance:
Regrets:

• Mechanical design of focal plane, 20180711_focalplane.pdf (.pdf) (UMN)

PICO telecon, July 11, 2018

• Toki: 1) focus should be at top of lenslets; 2) require an absorbing layer below the antennas to ensure broad band and high efficiency. Conceptually, can think of an array of spider webs right below the antennas. UMN to work on these. (AI)
• For CADR, high heat capacity of Invar may not be a problem. Check with Chris Paine and Peter Shirron (AI)
• Indium bump bonds are superconducting, not a great thermal conductor. check thermal conductance, calculate temperature gradient
• TDM chips will be fabricated on Si wafers, and bonded to detector wafers. Replace PCB board by silicon (AI)
• Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. Qi will check again after modification. (AI)